Used TATENO HBL4-420N #9395761 for sale

TATENO HBL4-420N Wafer Grinding, Lapping & Polishing Equipment is a robust and precise grinding, lapping and polishing system for use in semiconductor and other related industries. This unit is designed to achieve precise, high quality surface finish for various types of flat and contoured parts. The machine includes an advanced CNC controller, which offers flexible options for grinding, lapping and polishing processes. HBL4-420N is designed to grind, lap and polish workpieces from wafer size up to 200mm in diameter. The CNC tool comprises a 4-station grinding table, rotary table and a range of process application software. The process chamber is equipped with an inlet dust filter, a safety door lock, as well as an exhaust fan that is used for aspiration of dust and residue generated during grinding, lapping and polishing processes. The wafer grinding asset is optimized for the production of tight surface tolerances and superior surface finishes, with accuracies of up to 0.30 microns for single point diamond grinding applications on flat surfaces, and with accuracies even better than 0.10 microns for lapping processes. The CNC controller also has programmable auto-grinding settings for different types of materials, and the user-friendly interface allows programming and adjustment of the process parameters to achieve desired results. Furthermore, TATENO HBL4-420N model is provided with a diamond grinding wheel dressing equipment, which automatically dresses the grinding wheel depending on the shape of the part which is programmed for the grinding process. This guarantees that the optimum cutting surfaces remain on the wheel and that the dressing is carried out as quickly as possible with minimal damage to the wheel. This highly advanced wafer grinding system is able to achieve high throughput and high quality operations for a wide range of applications. It is designed to be easy to use, reliable and safe, and requires minimal maintenance for a long and efficient operation. It is the ideal choice for enterprises that require precision grinding, lapping and polishing operations on a large scale.