Used TATENO HBL6-420N #9395762 for sale

TATENO HBL6-420N is a revolutionary wafer grinding, lapping, and polishing equipment for semiconductor applications. It offers increased accuracy, speed, and efficiency in a wide range of applications, providing improved device yield and production capacity. HBL6-420N is a two-stage grinding system with a 200mm grinding frame and adjustable rotating power head. It features a robust fine-grinding unit and a powerful true lapping unit, providing an ideal solution for rough grinding, lapping, and polishing of large wafers with minimal breakage. The levered arm design provides ease of use, adjustable grinding pressure, and optimum abrasive loading, giving users extended grinding time. The main motor, variator, ball-bearing feeders, and pumps enable TATENO HBL6-420N to perform precise, repeatable grinding and polishing operations. The unit is easy to maintain and can produce high-accuracy, defect-free wafers even in the tightest tolerances. The built-in SRA (self-repairing algorithm) machine guides technicians in performing quick repairs as and when needed. Programmable motion speeds allow users to adjust the speed according to their needs. The machine features user-friendly software with an LCD touch screen interface and flexible operating modes. It also supports smart machines, which allow automatic cleaning, maintenance, and real-time monitoring. HBL6-420N utilizes independent grinding and polishing functions, enabling users to finish their work in one cycle using the same machine. Additionally, the tool features an inbuilt safety asset that helps protect users from injury and the device from damages, delivering a safe and secure environment in which to work. Moreover, TATENO HBL6-420N employs patented technological solutions to achieve uniform grinding surface quality, thus making it one of the most reliable wafer grinding and polishing solutions available. HBL6-420N is a compact, efficient, and reliable wafer grinding, lapping, and polishing model designed to provide users with optimal performance for semiconductor applications. This revolutionary equipment is perfect for those seeking powerful, yet precise products for wafer processing. With its robust performance and reliable technology, TATENO HBL6-420N is sure to exceed expectations.