Used TATENO HL-1M (N) #9395759 for sale

TATENO HL-1M (N) is a compact, all-in-one wafer grinding, lapping and polishing equipment. This single-stage process enables high quality grinding, lapping and polishing operations on wafers with precise control. The system can be used for pre- and post-grinding or lapping of various quartz or silicon wafers. The machine is composed of a grinding head and a loading stage with quartz/silicon wafer support. The machine is designed for adjusting the grinding speed, pressure, and the number of passes for various wafer treatments and material preparations. Its speed can be adjusted between 80 and 300 rpm while pressure is adjustable between zero and 10 kgf. A built-in safety control unit is included for temperature control and over-pressure prevention. The ground wafers are controlled by visual inspection and cleaned with dedusting machine. The grinding head has a constant speed gearing tool that is driven by an AC motor and is designed for holding various grinding blades. During the grinding and lapping process, the wafers are fed one at a time and automatically rotated for uniform surfaces. The pressure is precisely adjustable during the actual grinding and lapping process. This lightweight machine is very easy to operate and requires minimal setup time. It has an adjustable water flow rate and temperature control for efficient cooling of the ground wafers. The grindstone provides a free cutting surface with superior planeness following wafer treatment. It also has an advanced EPC (Electronic Pressure Control) asset which ensures precise grinding pressure throughout the process. This makes it an ideal tool for applications such as rough lapping and finishing, as well as for a variety of precision surface treatments. TATENO HL-1M (N) is perfect for both in-house and OEM level production. Its superior designs provide a true single-stage, all-in-one operation with excellent repeatability and accuracy of results. This high-quality wafer grinding, lapping and polishing model is a reliable solution for any kind of wafer preparation.