Used TATENO HP400DC-NA #9395760 for sale

TATENO HP400DC-NA Wafer Grinding, Lapping and Polishing equipment is a highly efficient and versatile machine for final planar polishing and surface finishing. This system is suitable for processing a variety of materials including silicon, gallium arsenide, germanium, indium phosphide, composite substrates, and any other materials requiring a very high-quality finish. The precision grinder can process wafers between 4'' and 12.7'' in diameter and is capable of grinding up to ten wafers simultaneously. It features a wide angle rotary precision grinding wheel to reduce the wafer to the required form with minimized stress. The machine is equipped with a temperature-controlled recirculating coolant unit and accurate molded vibration isolators for high-speed grinding with lower vibration levels. The in-situ process monitoring is further individually configured to provide the best grinding result. The integrated lapping and polishing module has an adjustable carrier for wafer size and delivers a superior finish as well as superior flatness and uniformity. The integrated high-efficiency autofeeder can transport up to twenty wafers at a time and is designed to ensure stable and consistent transitions from the grinding station to the polishing station. The polishing wheel creates a highly specific finish with minimal human interaction required. The machine is designed to be user-friendly, featuring touch screen control, multiple modes of operation, and simplified maintenance. The front-end of the machine provides real-time feedback, allowing operators to quickly monitor and control barometric pressure, temperature, and speed. The back-end of the tool is composed of a simple fine-tuning process, allowing operators to customize the asset for any material. Combining high speed and precision with an easy-to-use control panel, HP400DC-NA Wafer Grinding, Lapping and Polishing model is an ideal solution for performing high-precision surface finishing on a variety of materials. It provides a high-quality finish while ensuring the maximum efficiency, safety, and reliability for all grinding, lapping, and polishing tasks.