Used TCS TSL305-2P #9215452 for sale

TCS TSL305-2P Wafer Grinding, Lapping & Polishing equipment is designed to provide a precise, high-quality finish on single- or double-sided wafers. The system consists of two main components: a polishing engine and a precision turntable. The engine is designed for grinding, lapping, and polishing, and includes adjustable-speed drive technology, allowing for speed control that's accurate to 0.01rpm, programmable steps, and a wide range of grinding/polishing speeds. It also features automatic balancing on the turntable, allowing for an even, stable, and responsive operation. The precision turntable is designed to hold and accurately position up to two wafers up to 8 inches in diameter. It features a stepper motor-driven free turning spindle to perform bi-directional rotation, allowing for easier and more precise handling. The turntable also features a precision control unit for precise positioning, controlling the rotation speed of the turntable from 0.01rpm to 9.9rpm. TSL305-2P Wafer Grinding, Lapping & Polishing machine is also designed with a central control tool, which allows for the setting of multiple recipes, monitoring process variables, and controlling the overall asset. This ensures that the entire process happens accurately and precisely, as programmed. The model is also designed with a safety interlock to allow for safe operation, while also ensuring that all parameters are being followed. Additionally, the equipment includes an auto-abort feature to stop the system if an unexpected condition is detected. TCS TSL305-2P Wafer Grinding, Lapping & Polishing unit is designed to provide a precise, high-quality finish with accuracy and repeatability. It's a versatile and reliable machine that is designed for multiple tasks, including grinding, lapping, and polishing. Its combination of precision control, speed control, and safety features make it the perfect solution for grinding, lapping, and polishing wafers.