Used TCS TSL305-2P #9294733 for sale

TCS TSL305-2P wafer grinding, lapping and polishing equipment is an ideal choice for the fabrication of highly precise surface microstructures. This is a high performance system that is suitable for a wide range of applications. It is designed to provide a high level of accuracy and repeatability. TSL305-2P features a two-axis table for precise motion control and is equipped with specially designed lapping/polishing tools for optimal results. TCS TSL 305-2P unit is based on a combination of a rotating head and a two-axis table. It features an automated speed-controlled wafer grinding, lapping, and polishing program. The program controls the feed rate, grinding force, and lap speed. The machine offers both manual and automatic control over operations, with simple, easy-to-follow user interface. The tool includes a double precision DC motor and a micro-processor based single-axis controller for accurate and stable grinding speed control. The grinding speed can be adjusted from 0.2 mm to 4 mm. The grinding wheels are diamond impregnated, ensuring a high-grade surface finish. The grinding wheel is supported by a patented springloaded shaft for vibration-free performance. The asset is also equipped with lapping plates, which are available in various diameters depending on the requirements and the desired surface finish. The lapping plates are made of borosilicate glass and are coated with diamond plating for high precision results. The two-axis table allows for precise alignment of lapping plates and grinding wheels. TCS TSL305-2P also includes a special 'High-Sensitivity Digital Microscope', which allows for precise monitoring of the lapping/polishing process. It is also equipped with a 'Smooth Control Model' for precise speed and process control. TSL305-2P can be used with a variety of materials, including silicon, glass, and ceramic. Overall, TCS TSL305-2P equipment is a reliable and highly accurate wafer grinding, lapping and polishing system. It provides superior performance with its combination of sophisticated software and hardware. It is ideal for precision surface microstructures fabrication, and its advanced features make it an attractive choice for a wide variety of applications.