Used TECDIA (Wafer Grinding, Lapping & Polishing) for sale

TECDIA is a leading manufacturer of wafer grinding, lapping, and polishing equipment, offering innovative solutions in semiconductor technology. Their extensive range of systems includes the TEP 2000, TEG 2000, TEG 2003, and more, which are designed to meet the specific needs of wafer manufacturing processes. The wafer grinding units from TECDIA employ a unique technology called a fixed abrasive diamond wheel that ensures precise grinding with excellent flatness and surface roughness control. This technology eliminates the need for chemical mechanical planarization (CMP) and reduces the overall cost of manufacturing. The TEP 2000 system is ideal for general-purpose grinding, while the TEG 2000 is suitable for ultra-thin and fragile wafer grinding. The TEG 2003 system offers a high-speed grinding capability with improved productivity. TECDIA's lapping machines, such as the TECP 2000, provide precise and uniform wafer thickness reduction with minimal damage. These tools utilize a fixed abrasive lapping process to achieve high accuracy and repeatability in wafer processing. The TECP 2000 is designed for lapping single (diamond) and double-sided (boron carbide) wafers. TECDIA also offers polishing assets like the TEPOL 2000, which enable the production of wafer surfaces with the highest quality. These models use a unique combination of polishing pads and slurries to achieve the desired surface finish and flatness. The TEPOL 2000 system is used for general-purpose wafer polishing to improve surface roughness and planarization. TECDIA's wafer grinding, lapping, and polishing equipment provide several advantages, including precise control over the grinding, lapping, and polishing parameters, high throughput, low cost of ownership, increased productivity, and improved process efficiency. These systems are widely used in the semiconductor industry for applications such as manufacturing integrated circuits, MEMS devices, sensors, and more. Overall, TECDIA's wafer grinding, lapping, and polishing units offer cutting-edge technology, superior performance, and reliable solutions for the semiconductor industry.