Used TECHNOORG LINDA IV8 #293639515 for sale

TECHNOORG LINDA IV8 is a state of the art wafer grinding, lapping & polishing system designed to produce uniformly flat and highly precise surfaces on semiconductor and other types of wafers. This system consists of a set of integrated core technologies, including a precision grinding wheel, a lapping pad, and a polishing plate. The grinding wheel is designed to provide a highly efficient, precise, and controlled grinding action, while the lapping pad guides the wafer around in a controlled manner during the lapping stage. The polishing plate is designed to provide a smooth finishing action, giving the wafer a perfect mirror-like finish in a very short period of time. The grinding wheel is constructed of two layers, each with its own specific characteristics. The first layer consists of diamond particles, which allow for the grinding of the wafers at greater accuracy, produce higher yields, and greatly reduce grinding time. The second layer is composed of proprietary abrasive materials, which make it possible to achieve a high level of surface finish with the grinders. During the lapping stage, the lapping pad moves the wafer around in a slow, steady circular pattern, effectively creating even and consistent surface polishing. The lapping pad is designed to facilitate the removal of large amounts of material without damaging the substrate, as well as to ensure uniformity of the surface finish. The polishing plate helps to produce a highly reflective, mirror-like finish on the wafers. It is designed to use an oscillating motion to evenly distribute a high-tech polishing compound, while also removing any remaining abrasive particles in the process. This ensures a perfect finish every time. IV8 has a wide range of capabilities, such as the ability to grind to extremely tight tolerances, lapping rates of up to 11,500 wafers per hour, the ability to consistently polish a mirror-like finish, and the ability to handle a wide variety of materials. It is also capable of grinding and polishing substrates as large as 200mm. Overall, TECHNOORG LINDA IV8 wafer grinding, lapping & polishing system is an incredibly powerful tool for producing high-precision, uniform surfaces on wafers. It is designed to streamline the grinding, lapping, and polishing process, while providing a consistent level of quality and precision every time, allowing for fast production times and superior results.