Used TEL / TOKYO ELECTRON CERTAS LEAGA #9298658 for sale

ID: 9298658
Single wafer dry cleaning system, 12" 2016 vintage.
TEL / TOKYO ELECTRON CERTAS LEAGA is a programmable wafer grinding, lapping and polishing equipment that is designed to produce precise, high-quality wafers and chips. The programmable unit allows custom-made grinding, lapping and polishing to meet complex customer requirements. The system features the latest technologies in wafer grinding, lapping and polishing, including the use of a wet grinder, diamond lappers and high-precision polishers. This unit operates at high speed with specific kinetic energies, allowing for the grinding, lapping and polishing of larger wafers with improved accuracy and efficiency. TEL CERTAS LEAGA can be used for various wafer grinding, lapping and polishing operations. The machine can be programmed to grind, lap or polish both sides of the wafer at once. The machine is able to operate at different speeds, feather around corners, and use coarse, standard and fine grits for different applications. TOKYO ELECTRON CERTAS LEAGA is equipped with advanced parameters including wafer speed, knife grade, vacuum level, lap rotation speed, lapping position, total infeed angle and power operating temperature. This allows for the precise and customized grinding, lapping and polishing of the wafer. CERTAS LEAGA is also designed with an automatic cleaning and draining tool. This helps to prevent debris from entering the grinding, lapping and polishing machine and ensures that the wafer is consistent and clean for further operations. The asset is also equipped with a durable stainless steel housing and dust proof sealing. This design ensures that the wafer grinding, lapping and polishing is done in a clean and safe working environment. The model is also designed with a user-friendly operation panel with an easy to read display. Overall, TEL / TOKYO ELECTRON CERTAS LEAGA is an advanced and highly automated wafer grinding, lapping and polishing equipment that is designed to provide precise results with increased accuracy and efficiency. The programmable system also allows for custom-made grinding, lapping and polishing operations, allowing customers to meet their complex requirements.
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