Used TIMESAVER 137-1HDMW #9077651 for sale

TIMESAVER 137-1HDMW is a superior wafer grinding, lapping, and polishing equipment built and designed to provide high precision, repeatable results. This system is especially suited for demanding processes such as MEMS device development, semiconductor device fabrication, and more. The grinding station in the unit consists of a special, solid stainless steel liner designed to improve grinding accuracy by providing a flat, consistent surface for grinding, reducing track defect and related risk. A precision measuring machine automatically calibrates grinding wheels to remove any inconsistencies present in the materials. The tool is also equipped with a asset for particle control and dust collection, helping to ensure clean and consistent grinding results. The lapping station is designed to ensure ultraprecise and repeatable results. It is equipped with two massive precision lapping plates powered by a high-load electric motor controlled via a PC to provide greater repeatability. The polishing platen has a precise elevation model to ensure a smooth, repeatable motion for the polishing cycle. Additionally, the unit has an automated wafer orientation equipment which retains the exact orientation of the wafer to produce mirror-like results, as well as a dust collection system to guarantee a clean, dust-free environment for polishing work. Overall, 137-1HDMW is an ideal unit for wafer grinding, lapping, and polishing. It is an efficient, user-friendly, and advanced precision tool that can create consistent results on a variety of substrates. The machine is equipped with all the necessary components to provide the highest levels of accuracy in any process.