Used TOKYO SEIKI KOSAKUSHO CSN-6020T #9044099 for sale

TOKYO SEIKI KOSAKUSHO CSN-6020T is a state-of-the-art wafer grinding, lapping and polishing equipment. This system provides an innovative solution for precision wafer processing, allowing for faster and finer production of a wafer's surface. The unit is ideal for applications such as in the electronic, optoelectronic, and photonics industries. CSN-6020T consists of a frame, a polishing arm, a grinding arm, a lapping arm, a waste management machine, and a controller. The frame provides support for all the components and is made from sturdy and rust-resistant stainless steel. The grinding and polishing arms are made from precision aluminum and boast a light, yet durable design. The lapping arm uses powerful jets of air to mix the desired lapping agent effectively. This creates a consistent, uniform, and fine surface finish on the wafer. The waste management tool has been designed to work in a variety of ways. The asset easily dispenses a pre-determined amount of lapping and polishing agent onto the wafer, ensuring precise control of the material. It also helps to reduce waste and provide an effective solution for disposing of unwanted abrasive particles. The controller provides precise control for all the components. Operators can access a range of process parameters, including the speed, torque, pressure, and exposure time, to ensure maximum precision and durability of the wafer. The controller also helps reduce fine particle contamination, as all important parameters can be adjusted quickly and accurately. TOKYO SEIKI KOSAKUSHO CSN-6020T is a versatile wafer grinding, lapping, and polishing model. With its sophisticated controller, accurate waste management, and powerful lapping arm, this equipment is designed to meet the needs of a wide range of industrial requirements. It is an ideal choice for achieving high-precision wafer surfaces in a cost-effective and efficient manner.