Used TOKYO SEIKI KOSAKUSHO GSZ15020-1A #9156493 for sale

TOKYO SEIKI KOSAKUSHO GSZ15020-1A Wafer Grinding, Lapping & Polishing Equipment offers a comprehensive and full range of capabilities to accurately process a variety of materials and complex forms. This industry-leading system is designed with a rigid bedframe construction that offers superior stability and rigidity, ensuring optimal control of all grinding, lapping and polishing operations. This unit is used for a wide range of applications, such as high-volume production runs and difficult shapes, and is suitable for wafers with diameters ranging from 50.8mm to 300.00mm. GSZ15020-1A is engineered with a feeding machine that includes a spiral-type feeding discs that ensures repeatable, smooth feed rates. It also includes an air-lift rotary table with unique connection allowing for easy removal and installation of lapping plates in order to maximize production efficiency. For increased flexibility in the processing of complex shapes and sensitive materials, TOKYO SEIKI KOSAKUSHO GSZ15020-1A is equipped with an independent, user-adjustable, 5-axis in/out grinding wheel holder that can be easily changed to suit the requirements of each part. The tool's high precision grinding capability is achieved by featuring a wheelhead featuring 3 independent feed spindles with linear slides, and a grinding wheel spindle with X-Y-Z movement capability. For lapping and polishing, the asset is equipped with a grinding wheel and belt-driven lapping spindle that can be operated in a variety of modes such as saw cutting, diamond grinding, flat polishing, and more. GSZ15020-1A also offers "Smart Operation" functionality that enables the operator to quickly and easily set-up and optimize the production process through the modern touch-screen operation panel. TOKYO SEIKI KOSAKUSHO GSZ15020-1A has an ergonomic, compact design and it's configured with an efficient dust collection model to maximize efficiency and production quality while minimizing worker fatigue and environmental impact. This equipment is also equipped with a digitally controlled cyclone system for power clean, which reduces the maintenance time. This unit is ideal for cleanroom environments and is fully compliant with CE standards. GSZ15020-1A Wafer Grinding, Lapping & Polishing Machine is the top of the line tool for any production floors looking to increase their throughput and accuracy. It is designed to handle complicated parts with superior grinding, lapping and polishing capabilities that guarantee perfectly shaped products with high precision and reduced waste. This machine provides the flexibility needed to tackle any project and the accuracy and consistency needed to guarantee the production of parts within tolerance.