Used TOKYO SEIKI KOSAKUSHO S-LM-200B #9257634 for sale

TOKYO SEIKI KOSAKUSHO S-LM-200B is a state-of-the-art wafer grinding, lapping & polishing equipment. This system includes tumbling drums, drive motors, vacuum cleaners, jigs, and other components to achieve a high quality end result. It is suitable for grinding and lapping large diameter silicon wafers up to 200mm (8 inch). The tumbling drum is designed for use in the production of semiconductor wafers and incorporates a variety of features, allowing for optimal control and ease of use. The drum is constructed from aluminum alloy with an anodized finish to ensure a robust and corrosion-resistant exterior. The interior is designed with a series of angled baffles, allowing for efficient grinding and lapping of wafers at various angles. The drum is filled with fine silicon carbide (SiC) or diamond media to achieve the desired polished finish. The unit comes with a pair of AC drive motors that power the tumbling drums. These motors are designed for use in the harsh environment of S-LM-200B, ensuring that they can withstand the inert atmosphere of the grinding, lapping & polishing process. The motors are also equipped with overload protection mechanisms, in case of an unexpected power surge. The machine also includes a special vacuum cleaner, designed to efficiently collect any excess media from the work surface. The vacuum cleaner is outfitted with a durable filter to prevent any debris or media particles from entering the work area. Finally, the tool comes with a set of jigs to accurately set and maintain the wafer's orientation during the grinding, lapping & polishing process. These jigs are designed to fit large diameter silicon wafers up to 200mm (8 inches) in size. TOKYO SEIKI KOSAKUSHO S-LM-200B is a well-designed, robust asset suitable for a variety of wafer grinding, lapping & polishing applications. The tumbling drums, drive motors, vacuum cleaners, and jigs are all designed with precision in mind, allowing for a high quality and consistent end result. This model is ideal for those who require a reliable, cost-effective wafer grinding, lapping & polishing equipment.