Used TOKYO SEIKI KOSAKUSHO S-LM-223B #9257633 for sale

TOKYO SEIKI KOSAKUSHO S-LM-223B is a wafer grinding, lapping, and polishing equipment designed to provide high-precision results in a range of challenging applications. This system utilizes an advanced spindle design capable of both single- and multi-axis operations, offering smooth and consistent grinding, lapping, and polishing performance. A powerful CNC control allows for a wide variety of grinding, lapping and polishing movements, all managed with accurate precision. S-LM-223B is equipped with an intelligent speed control (ISC) to optimize spindle performance for each individual job, ensuring effective cutting and efficient waste of material. With a wide selection of grinding and lapping stones, TOKYO SEIKI KOSAKUSHO S-LM-223B can create a wide variety of novel shapes and surfaces with exacting precision. The unit features a number of automated features designed to minimize operator fatigue and ensure safe operations. An ergonomically designed operator console allows for easy access to all controls, while the machine's intuitive user interface makes it easy to select and program grinding and lapping curves for a range of materials. The tool also includes a variety of safety features, such as an emergency stop (E-stop) button to shut the asset down quickly and safely in the event of an emergency. S-LM-223B also comes with a range of high-quality polishing pads and plates to ensure a perfect, uniform finish on wafers. TOKYO SEIKI KOSAKUSHO S-LM-223B is constructed from a robust steel and aluminum alloy frame that provides excellent durability and makes the model suitable for high-volume production lines. This equipment is an ideal choice for those seeking reliable and consistent grinding, lapping, and polishing systems that offer precision, productivity, and safety.