Used TOKYO SEIMITSU S-LM-116G #9263444 for sale

TOKYO SEIMITSU S-LM-116G
ID: 9263444
Inner circumference slicers.
TOKYO SEIMITSU S-LM-116G is a powerful wafer grinding, lapping and polishing equipment for processing silicon wafers. It offers an efficient and precise grinding process for grinding and lapping wafer surfaces. The machine features a lapping plate and various abrasive materials which can be applied to accomplish a wide variety of applications. The core of S-LM-116G is the advanced mechanical grinding configuration. This includes a specially designed grinding head that is precise and dynamic. A high-rigidity base frame supports the entire machine during the grinding operations. The powerful motor and drive system provides control for consistent process. The grinding process is automated and controlled through the user friendly control panel. The machine comes with four grinding spindles that help evenly distribute the grinding force and pressure. As the spindle rotates in the presence of the grinding agent, the highly efficient lapping plate creates an even and uniform surface on the wafer. The abrasive media is adjustable and can be fine-tuned to achieve the desired effect. TOKYO SEIMITSU S-LM-116G also features a unique lapping unit which is equipped with high precision diamond lapping plates. This helps to achieve a superior level of surface finish which is impossible with traditional belt lapping. The lapping plates are equipped with a built-in air turbine that helps to reduce surface irregularity and achieves a completely flat result. S-LM-116G also offers many other features such as operator safety sensors, automatic water flow control, and a built-in waste management machine. This ensures that the process is safe and efficient with minimal environmental impact. Overall, TOKYO SEIMITSU S-LM-116G is an efficient and powerful wafer grinding, lapping and polishing tool. It offers an automated, precise, and safe grinding process for processing silicon wafers. The machine is equipped with a variety of grinding tools and features which provide easy and consistent control to achieve the desired results. This asset is ideal for many industries, including semiconductor, optics, and precision engineering.
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