Used TOS HOSTIVAR OD Grinder #156001 for sale

TOS HOSTIVAR BUB 32/1000 wafer grinding, lapping, and polishing equipment is a high-precision apparatus designed to meet the rigorous demands of grinding, lapping, and polishing semiconductor wafers. It features a powerful 32kW main drive motor that enables high-precision operation with maximum material throughput thanks to its robustly rigid frame construction and extremely low vibration levels. The system is equipped with a hard carbon-molybdenum alloy grinding wheel for fast stock removal and a soft-bond diamond wheel for a final finish. The lapping plate is designed with a drive motor and ultrasonic motor that allows for smooth and uniform material removal. The unit is completed with a polishing pad that holds a pure diamond grit compound. The unit is completely enclosed with a interlocked front door and isolated front panel to protect the operator during use. The machine also has an advanced endpoint detection tool to ensure accuracy of the grinding and polishing process. All of the components of TOS HOSTIVAR BUB 32/1000 are designed and manufactured in accordance with EN, ISO 9001 and 14001 standards, ensuring the highest quality of operation and durability. The machine is easy to operate and user-friendly, allowing operators to quickly identify, configure and maintain the unit with minimal training. Additionally, the machine is equipped with a safety asset that automatically shuts down the unit in the event of overload or hazardous conditions to protect personnel. TOS HOSTIVAR BUB 32/1000 model is designed to provide precision wafer grinding, lapping, and polishing with the utmost accuracy and efficiency in a safe, reliable and cost-effective manner. With its built-in level of automated efficiency, TOS HOSTIVAR BUB 32/1000 proves to be the perfect machine for high-precision manufacturing.