Used TOSHIBA / SHIBAURA KRTC-11A #9260801 for sale

TOSHIBA / SHIBAURA KRTC-11A is a high-precision, automated wafer grinding, lapping and polishing equipment designed to increase throughput and improve production efficiency. This fully automated system can process up to 12 wafers in one cycle and is designed with an intuitive user interface to make operation fast and easy. TOSHIBA KRTC-11A includes both a wafer grinding and polishing station, along with an advanced lapping station that incorporates diamond abrasive technology to achieve a high degree of flatness and surface finish. The unit includes a robotic wafer load/unload arm that picks up and transfers wafers to each station, allowing multiple wafers to be processed in parallel. The wafer grinding process starts with the loading of wafers into a grinding chuck that is adjustable in angle and tilt. Each step of the process is precise and controlled through the machine's touch screen user interface, where parameters such as grinding wheel speed, allowance, dressing frequency, and grinding pressure are adjustable. The wafer is then lapped and polished using a reliable slurry feed tool to ensure uniform slurry application and a thorough cleaning process. The asset's advanced lapping station can accommodate a wide range of polishing pads and can work with different types of polishing slurry to achieve a precise flatness of up to 0.5 micrometers and a smooth surface finish of up to 5 nanometers. The entire cycle, from loading to unloading, takes less than 30 minutes, making it a great choice for high-volume production requirements. SHIBAURA KRTC-11A also features a wafer mapping function which can be used to inspect both global and local topography of each processed wafer for the highest level of accuracy. In addition, the model is designed to be easy to maintain and repair and is backed by TOSHIBA reliable service and support network. Overall, KRTC-11A is designed to provide a cost-effective solution to achieve ultimate precision and repeatability for individual wafer processes. Its fast processing speed, robust construction, and user-friendly interface make it an ideal choice for wafer grinding, lapping, and polishing.