Used TOSIHBA KRTC-11A #9208868 for sale

The TOSHIBA TOSIHBA KRTC-11A is a highly advanced wafer grinding, lapping, and polishing machine, used primarily in the production of semiconductor wafers. It is the latest model in a series of KRTC machines, designed to provide a "next-level" of performance in wafer processing. The machine is made up of a control console, a polishing head, and a lapping head. The control console is the central element of the equipment, and is responsible for controlling the operations of the system. It is equipped with an advanced LCD display allowing the user to monitor unit status and adjust parameters, as well as a range of sensors and logic controls for safety. The polishing head is designed to grind the wafers using diamond-grade abrasives, and the lapping head is used to finish the wafers with lapping films. KRTC-11A is an extremely precise machine, designed to produce a surface roughness of ±5 nanometer for most materials. It achieves this through its high-precision 3-Axis drive machine, which ensures ultra-fine surface finishing accuracy. Furthermore, TOSIHBA KRTC-11A is highly efficient, with an average cycle time of 0.8 hours and up to 200 wafers per hour. KRTC-11A is protected with a special dust filtering tool. Its internal components are highly resistant to wear and tear, and a special cooling asset ensures that the machine is always operating at optimum levels. The model also has an automatic loading and unloading equipment for maximum efficiency. Additionally, it comes with a comprehensive post-processing system, which allows for traceability of wafer numbers, lots, and grades. TOSIHBA KRTC-11A is a highly advanced wafer grinding, lapping, and polishing machine, designed to produce excellent wafer quality for the most demanding production environments. It combines precision, accuracy, and efficiency, making it the ideal unit for demanding semiconductor wafer production.