Used TRIPET MAR 200 #9069646 for sale

ID: 9069646
Internal grinding machine Max. internal grinding diameter: 50 mm Min. internal grinding diameter: 1.0 mm Grinding depth: 200 mm Centre height: 132 mm Workpiece spindle speeds:50 rpm to 1500 rpm Max. angle: 90 ° Possible grinding-spindle speeds: 9000 rpm to 70000 rpm Table speeds:stepless up to 10.00 m/min Voltage: 50 Hz 3x 380 Volt Workpiece spindle motor: 0.80 kW Drive for internal grinding spindle: 3.0 kW.
TRIPET MAR 200 is an advanced, high-precision wafer grinding, lapping, and polishing equipment. It is specifically designed for the grinding and polishing of wafers for the semiconductor industry. The system features advanced, ultra-smooth operation, which ensures the highest level of precision and quality. The machine utilizes a two-step grinding and polishing process, with both processes being driven by a single, high-torque electric motor. The first step is the grinding operation, which uses diamond grinding wheels to remove burrs and other irregularities from the wafer surface. This process achieves a micron-level finish, creating a flat, defect-free surface. The second step is the polishing operation, which uses diamond polishing wheels to achieve an even, mirror-like finish on the wafer's surface. MAR 200 is a fully automated unit, meaning it can run unattended for long periods of time. It features built-in safety features to protect operators from possible hazards. The machine is also equipped with an advanced control machine, which allows users to monitor the grinding and polishing progress. It is capable of grinding and polishing up to 500 wafers per hour, making it an ideal solution for high-volume production. The tool is designed to handle a wide variety of wafer sizes and thicknesses, ranging from 3mm to 20mm. It is also equipped with a cooling asset to ensure optimal grinding and polishing performance. Additionally, it is capable of grinding wafers to a tolerance of less than 10 microns. TRIPET MAR 200 requires little maintenance and is easy to operate. It is also highly energy efficient, making it an environmentally friendly option. The model is an ideal solution for the semiconductor industry, bringing the highest level of precision and quality to wafer grinding and polishing operations.
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