Used TRIPET MUR 100 #180841 for sale
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ID: 180841
Internal grinding machine
Specifications:
Max. internal grinding diameter: 15 mm
Min. internal grinding diameter: 0.5 mm
Grinding depth: 75 mm
Center height: 60 mm
Distance between centers: 125 mm
Max. work piece diameter: 80 mm
Workpiece spindle speeds:
Stepless from 150 rpm up to 1500 rpm
Spindle hole 12 mm
Grinding table travel: max 225 mm
Table speeds:
Stepless from 1 m/min up to 8 m/min
Voltage 50Hz, 220 Volt
Workpiece spindle motor 0.3 kW.
TRIPET MUR 100 is a wafer grinding, lapping and polishing equipment designed to meet the high accuracy and surface finish requirements of the semiconductor industry. The system is versatile, capable of grinding, lapping and polishing a variety of hard and semi-conductive materials, from silicon wafers to sapphire and glass substrates. MUR 100 is built on a solid steel base for high rigidity and stability, ensuring consistent results even in industrial environments. The unit has three grinding modules: a main grinding head for coarse grinding, a secondary grinding head for final grind and edge trimming, and a lapping and polishing head for post processing. Each module is independently adjustable for precise grinding, lapping and polishing parameters, allowing users to select the most suitable settings for their specific application. TRIPET MUR 100 also features automatic feed and speed control, with a custom-built software package offering various grinding and lapping programs. The machine uses a wide range of abrasives and lubricants that can be optimized to suit the desired outcome. The high-pressure grinding and lapping module employs a unique wet grinding technique to deliver superior particle size reduction and surface smoothing. MUR 100 is also equipped with an integrated cooling tool to ensure uniform grinding and lapping temperatures. The precision of the final product depends on the pre-grind parameters and wafer flatness. The asset offers several advanced features to help ensure micrometer precision, including a vacuum-bonded grinding wheel to increase the lateral accuracy, and an optical flat for precise in-plane alignment. TRIPET MUR 100 is an ideal solution for semiconductor manufacturing and testing, where repeatability, precision and surface finish are key. It is a 2-in-1 solution combining roughing and post-processing, as well as providing superior results within a reasonable time frame. The model's user-friendly software and automatic feed and speed control make it easy to use and its versatile design means it can handle a variety of applications with ease.
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