Used TSCHUDIN HTG 22 #9255925 for sale

TSCHUDIN HTG 22 is a wafer grinding, lapping and polishing equipment used to fabricate high-quality finished wafers. The machine is designed with a stainless steel tabletop and a powerful electro-mechanical drive system making it a space and energy efficient wafer grinding solution. The machine grinds wafers up to 8" diameter and up to 5mm thick. It has powerful pumps to move lubricant and water through the grinding and polishing process. To ensure a consistently high-quality finish, the machine features accurate and precise speed, pressure, and force control for optimum operation. HTG 22 utilizes a patented grinding wheel spindle which maintains low thermal loads and generates minimal vibration for controlled working and more accurate results. Its advanced grinding wheel allows for a range of grinding geometries and provides superior surface finish results. The machine also incorporates an integral wet/dry switching unit for a range of process options from coarse grinding to ultra-fine polishing. TSCHUDIN HTG 22 includes a multi-zone chamber cooling machine that protects the wafers from heat to ensure repeatable and accurate polishing results. It features an automated loading/unloading tool to transfer wafers from the grinding chamber, as well as a motors for precise motion control. To further ensure precise grinding and polishing, HTG 22 includes an ergonomic user interface with intuitive LCD display and illuminated buttons that provide clear information about the settings and status of the machine. The interface also allows for adjustment of the parameters for grinding or polishing operations, including speed, force, and pressure. In conclusion, TSCHUDIN HTG 22 wafer grinding, lapping and polishing asset provides an efficient and reliable method of producing superior-quality finished wafers. The machine is designed with robust components, reliable drive systems, temperature control, and a user-friendly interface for easy and accurate operation.