Used TSKK CSN4515GLD-GOX #9390962 for sale

TSKK CSN4515GLD-GOX is a wafer grinding, lapping & polishing equipment. This system is designed to produce planarized and polished wafers with high quality surface finish and consistent flatness. The unit is equipped with advanced technology, features and functions to meet the requirements of ultra-low and ultra-precision processing. The machine is capable of completely automating the grinding and polishing process by using its precision-engineered tool structure and machine components. CSN4515GLD-GOX features a grinder, lapper and polisher mechanism, an automatic feeder and unloader, and a monitoring asset. The grinder mechanism is a high-speed spindle that utilizes advanced diamond grinding wheels to achieve a desired surface finish. The lapper and polisher mechanism is also a high-speed spindle that uses silicon carbide powder or diamond abrasives to achieve optimal surface roughness. The grinding, lapping and polishing process is monitored and controlled by the automated feeder and unloader. It consist of a wafer chuck plate and an automated cassette handling model which is used to handle wafers. The process control equipment of TSKK CSN4515GLD-GOX allows it to keep track of data related to the grinding and polishing process, such as the spindle speed, diamond wheel wear and the grinding angle. This information can be used for optimal process control for any given application. The system also features a vacuum unit, which is used to ensure a clean process environment. CSN4515GLD-GOX is capable of providing advanced wafer surface profile, planarity and mirror finish. Its design allows for high precision grinding and polishing of wafers from ultra-low to ultra-high precision, providing great accuracy and repeatability. The machine can be customized for specific applications and is suitable for a wide range of photovoltaic, electronic, optoelectronic and other applications.