Used TSKK TSF-4020 #9390941 for sale

TSKK TSF-4020 Wafer Grinding, Lapping & Polishing Equipment is an innovative system designed to offer precise automation for the grinding and polishing of semiconductor wafers and other MEMS components. This advanced unit is designed to provide high-end solutions for reliable and consistent grinding and polishing process with high precision surface finish. It features a robust construction with a superior high performance grinding head that comes with heat management technology. TSF-4020 machine comes with dual table configuration and an adjustable grinding slide to provide efficient and uniform grinding and polishing of complex substrates. The tool includes high precision automatic spindle drive which can be used to control speed, accuracy and uniformity of the grinding process. The asset also includes a slurry subsystem that dispenses a pre-determined amount of slurry and can be used for high performance lapping and polishing applications. In addition to this, TSKK TSF-4020 features a unique air bearing configuration to provide precise clearances between the grinding head and the wafer, allowing lower applied forces to be used to reduce the chipping and etching of the devices. Overall, TSF-4020 is an innovative model that provides an efficient and consistent grinding and polishing process which is specifically designed for MEMS production. This equipment is designed to reduce the manual labor and improve the grinding and polishing results while providing a reliable and economic solution. The system is ideal for processing wafers and other MEMS components and offers a wide range of features including adjustable grinding slides, dual table configurations, and a slurry subsystem for lapping and polishing applications. TSKK TSF-4020 is the ultimate solution for production environments requiring maximum productivity, precision, and consistency.