Used TSUNODA SV-36 #9093451 for sale

TSUNODA SV-36 is a precision wafer processing equipment designed to grind, lap, and polish wafers for a variety of industrial and research applications. It is well suited for applications such as semiconductor devices, MEMS, optics, and thin-film optical filters. SV-36 is designed to produce wafer surfaces of high accuracy and with superior surface uniformity. It achieves this through a precise combination of simultaneous grinding, lapping, and polishing processes. The grinding wheel can be outfitted with a variety of grinding, lapping, and polishing media, depending on the application, with the option of fine and ultra-fine diamond abrasives. The system also features a dynamic pressure control unit to ensure uniform material removal, ensuring a uniform surface texture and structure. The grinding wheel is driven by a DC brushless motor, providing a wide range of speeds and excellent accuracy. It is also equipped with a vacuum feed machine, allowing for direct grinding of pre-cleaned wafers for improved surface finish and reduce contamination. The tool can be used to process wafers up to 8" (200 mm) in diameter and 1" (25.4 mm) in thickness, with a maximum working area of 125 mm. The grinding wheel is enclosed in a stainless steel cover to contain dust, while the asset is enclosed in an epoxy panel with sound-absorbing material for quiet operation. TSUNODA SV-36 is an ideal choice for a variety of wafer processing applications that require precision grinding, lapping, and polishing. With its advanced features and precise controls, it can provide consistent and quality results with minimal wastage. The model can be configured for manual or semi-automated operation, making it highly suitable for research and development, as well as production applications.