Used UDAGAWA 50 #77468 for sale

UDAGAWA 50 is a wafer grinding, lapping and polishing equipment designed for the manufacture of silicon wafers and semiconductor substrates. It is equipped with a high-precision CNC linear feed system, ensuring a high degree of accuracy and speed. 50 unit is capable of processing a wide range of sizes and types of wafers, such as double-sided, single-side, and unspecified-size wafers. The grinding and lapping process begins with wafers placed onto the prime stage. A vacuum cup is then employed to provide holding and indexing of the wafers before grinding. The grinding stage involves the use of a rotating diamond wheel to grind the entire circumference of the wafer, creating a flat surface. This is followed by a polishing stage, wherein a rotating silica polishing wheel is employed to achieve a flat surface with a high degree of accuracy and uniformity. UDAGAWA 50 lapping machine utilizes a patented, dual-rotating disk lapping mechanism. This mechanism provides a highly accurate and controlled lapping process, where the disk can be easily adjusted for varying wafer sizes. In addition, a highly focused dynamic lapping tool is used for higher levels of accuracy. A micron-level thickness controller is also available to provide precise control over wafer thickness. The asset is equipped with a user interface that features a number of advanced features, such as parameter setting and data acquisition. Smart functions include automatic lapping optimization and loading of processing recipes. The model also features an alarm function that warns the operator when parameters are not being followed or the process is not meeting set specifications. 50 equipment is equipped with a range of safety features, including emergency stop buttons and safety guards. These prevent accidental contact with the equipment and harm to operators. The system is also certified to meet the highest safety standards. UDAGAWA 50 unit is capable of providing accurate, high quality wafer grinding, lapping and polishing. This makes it an ideal solution for semiconductor manufacturing processes, where precision and repeatability are vital.