Used UDAGAWA UJ1-II #77470 for sale

UDAGAWA UJ1-II is a fully automated wafer grinding, lapping, and polishing equipment for semiconductor devices, designed to achieve the highest quality finish on any device substrate. This system features a high-precision CNC-controlled spindle, allowing the user to precisely control the grinding and lapping head, while maintaining a uniform surface of the workpiece. The grinding and lapping heads of this unit use diamond and diamond-coated abrasive wheels that allow for the efficient removal of materials from the substrate without damaging the device substrates. The machine also incorporates a single-point diamond polishing pad for achieving the smoothest and most uniform surface possible. UJ1-II also includes a pressure-control tool to ensure the consistency of grinding and lapping pressure during the process. The pressure settings are adjustable according to the desired shape and size of the desired finish on the substrate, while also allowing the user to precisely control the removal rates of very thin layers of material. The asset also features a programmable interface, allowing the user to set exact timing and angles for each grinding, lapping, and polishing step. In addition to its advanced mechanical and control systems, UDAGAWA UJ1-II also features a cleansing station, which ensures that any debris or contamination remaining after process is efficiently removed. This unit also includes an air-tight interlock, to ensure complete protection of the device before, during, and after the process. The model's advanced control settings also allow the user to control the movement of the heads and increase or decrease the pressure levels during grinding and lapping to ensure that optimal results are achieved. UJ1-II also includes a truing attachment, which provides additional convenience for the user by allowing for manual adjustment of the diamond and abrasive wheels should the need arise. Overall, UDAGAWA UJ1-II equipment is a high-precision, automated grinding, lapping, and polishing system that allows the user to achieve consistent and accurate results, while also providing an enhanced level of safety and convenience throughout the process. This unit is ideal for manufacturers of semiconductor devices that require extremely precise finishing, as well as researchers and students seeking to achieve the highest-quality results in their experiments.