Used UEDA / CYBEQ IP 8000 #153732 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
Sold
ID: 153732
Wafer Size: 6" - 8"
CMP polishing tool, 6" - 8"
Designed to process up to (6) 6" / 8" wafers at once
Integrated head retraction system
Can be modified to include 4" / 5" wafers
At a polish setting of 1 minute:
Cycle time: 6.5 minutes
Throughput: 55 wafers per hour
Dual input wafer cassettes
Load side cassette nests are designed to tilt from 0 to 90°
Unload side cassette nests are open backed and remain at a constant 90° over (2) height adjustable DI water tanks
Each cassette can hold up to (25) 6" / 8" wafers
Each side holds (2) cassettes
Previous processes run: STI, ILD, BPSG, Tungsten (single step Cabot slurry and specific pad), Poly Silicon (addition of a heated platen from a closed loop M&W heater / chiller), silicon wafer reclaim
Wafer planarization of ~50 angstroms across surface of all wafers with a range between heads of <80
Edge exclusion of 3mm achievable
Specifications:
Polishing System:
Employs 3 degrees of motion: platen, carousel, and carriers, plus eccentric motion
Wafer Handling Capacity:
150 mm or 200 mm diameter (100/125mm possible)
2 Cybeq Articulated Robots
2 Head Loading Modules (HLMs)
Dual input and output cassettes
Wafer Carriers/Heads:
6 floating heads (patented design)
Programmable retracting heads allow 2 to 6 wafers per polishing cycle
Programmable speed from 1 to 30 rpm +/- 1%
Programmable uniform down force air pressure from 1 to 10 psi
Powered by a brushless servo motor
Wafer Cleaning:
Automated nozzle rinse with DI water after polishing
Automated low pressure DI water polishing/cleaning cycle after polishing
Platen:
36” diameter
Made of number 304 stainless steel
Polyurethane coated on exposed surfaces for acid based slurries
Programmable speed from 1 to 35 rpm
Programmable rotational direction, cw or ccw
Powered by a brushless servo motor
Optional temperature control unit
Carousel:
30” diameter
Made of anodized aluminium
Polyester-urethane coated on exposed surfaces
Programmable speed from 1 to 30 rpm
Programmable rotational direction, cw or ccw
Powered by a brushless servo motor
Pad Dresser:
Optional 4” or 12” diamond disc
Programmable speed from 1 to 30 rpm
Programmable down force from 0 to 200 lbs
Slurry:
Dual peristaltic pumps feeding through dual or separate PALL filters
System Control:
Microsoft Windows Graphical User Interface (GUI) with front and back TFT touch screen controllers/monitors
Multiple steps of unlimited polishing recipes
Siemens PLCs for motion control
Fully automatic or semi-automatic operation
Optionally SECSI, II, and GEM capable
Facility:
200 –240 VAC, 3 phase 50 – 60 Hz, 60 amps maximum, AC – line filter
CDA, 80-90 psi at 2 cfpm
Nitrogen, 60 psi at 2 cfpm
DI water, 2 to 4 gpm at 40 psi
Slurry, 2 x 1/2” inputs, minimum 12psi.
UEDA / CYBEQ IP 8000 is an advanced wafer grinding, lapping and polishing equipment designed for increased productivity, accuracy and efficiency. It is intended for use in a comprehensive range of applications such as device technologies, semiconductor substrates, and MEMS structures. The system employs an innovative design featuring integrated hardware, software, and automation components to simplify setup and operation. This unit features an adjustable-pitch, bi-directional grinding wheel, mounted on a stable platform, and a controllable lapping and polishing apparatus. The bi-directional wheel ensures even grinding, while the adjustable-pitch wheel ensures smooth and even lapping and polishing. UEDA IP 8000 is capable of grinding, lapping, and polishing wafers up to three inches in diameter and with thickness ranging between 25 and 200 μm. It also provides accurate, automated control over grinding parameters such as speed and pressure, as well as lapping and polishing force and media feed rate. Additionally, this machine also has an adjustable-depth-of-cut feature, allowing for automated fine adjustment of grinding rate. This tool is designed for high-end users, and features multiple data inputs and outputs, assuring smooth and consistent integration into a production line. It also provides multiple safety features such as door interlock, and the ability to modulate the speed and force of the grinding and lapping equipment to minimize potential damage to wafers. CYBEQ IP 8000 offers excellent precision and is capable of delivering high-quality, uniform finishes. While designed for high-end users, this asset is also suitable for a wide range of applications and is easily incorporated into an existing production line. With its automated integrated design, this model is an ideal choice for those seeking an efficient and reliable wafer grinding, lapping, and polishing equipment.
There are no reviews yet