Used UHT PZ-ROBO N2 #9264960 for sale

UHT PZ-ROBO N2 is a wafer grinding, lapping and polishing equipment used in semiconductor fabrication. This system is designed to clean the surface of semiconductor wafers for various applications such as creating finer patterns and improving the surface flatness. It is an automated, highly-precise and easy-to-operate unit. PZ-ROBO N2 is capable of handling wafer sizes from 3- to 8-inch diameter (150mm) and uses single and double-side wired brushes as abrasive tools. The machine is equipped with a pre-aligner that reduces polishing time since the polishing tool can be placed quickly and accurately on the target area without any additional trial or errors. The tool has a user-friendly design with a large touch screen and intuitive operator interface, providing easy access to the most commonly used functions. The asset includes an automatic model software that processes the wafer and adjusts lapping and polishing programs. The equipment is designed to make optimal use of the materials and energy, significantly reducing the cost of substrate processing. Additionally, UHT PZ-ROBO N2 is equipped with an interferometer that measures surface flatness during operation and provides information on the amount of lapping/polishing that needs to be done to achieve the desired uniformity. The system also includes a visual recognition unit that detects any surface wear or damage and provides instant feedback. Overall, PZ-ROBO N2 is an innovative wafer grinding, lapping and polishing machine that provides superior surface quality, precision and control. This tool can dramatically reduce costs related to substrate processing and polish time while providing a high level of accuracy. The asset is a great solution for semiconductor fabrication and a range of other applications.