Used UNICOTE HSL-175 #175124 for sale

UNICOTE HSL-175 is a wafer grinding, lapping & polishing equipment designed for high-volume production applications. It offers four grinding positions, two lapping positions, and two polishing positions. This system is capable of processing different wafer sizes and substrates, allowing you to process a wide variety of materials with ease. The unit includes a fully automatic precision grinding head, two lapping heads, and two polishing heads, each with different speeds and directions to achieve the optimal results. The machine also includes two separate work benches to allow processing of two different wafers at the same time. HSL-175 tool is designed to provide a high level of precision while providing an easy to use asset. The model includes PLC and servo motor controls, as well as a full range of safety features to ensure operators remain safe during operation. The grinders, lappers, and polishers all include adjustable rotational speed and force for achieving the desired results. The equipment also includes a wide range of grinding, lapping, and polishing materials, such as diamond, alumina, and Silox. The system also includes data logging capabilities to record and track the progress of each process. UNICOTE HSL-175 is designed to deliver consistent quality wafers and substrates with high yields. This unit provides a robust and powerful solution to meet a wide range of wafer grinding, lapping, and polishing needs. The machine can be used to produce wafers, substrates, and other materials for use in many industries, such as semiconductors, microelectronics, optics, MEMS, and others. With the ability to process a variety of materials and sizes, this tool is a highly versatile and capable asset for achieving your production needs.