Used VEECO / ADVANCED IMAGING Custom #9122392 for sale

VEECO / ADVANCED IMAGING Custom (AIC) is an integrated and automated wafer grinding, lapping and polishing equipment designed to meet the requirements of semiconductor device research and production. It is a state-of-the-art wafer fab processing system designed to provide quality control, cost savings, and improved productivity. The AIC unit enables precise finish characteristics with uniform flatness and very low roughness. It utilizes a single turnkey machine package with full automation capabilities with built-in auto-cassette loading and handling. The AIC process windows are optimized to enable tight control of process times and settings. It also includes a unique wafer holder tool and adjustable process heads that are automatically adjusted to the wafer diameter for optimal performance. The AIC asset consists of three major components: the mechanical grinding and polishing model, the software-based motion and process controllers, and the vision & process monitoring equipment. The mechanical system provides accurate grind and polish operations with a high degree of precision. The software is used to control the motion of the unit and the automated process controls. The last component, the vision & process monitoring machine, provides detailed images of the wafer surface at various stages of the production process. The mechanical tool includes a variable speed motor, chuck, vacuum asset, and adjustable grinding and polishing heads. It supports both dry and wet processing with the ability to change the grinding and polishing parameters during operations. The model also has options for lapping and high-pressure grinding processes. The software-based controllers used in the AIC equipment are highly automated and user-friendly. The software allows users to control various aspects of the process such as polishing pressures, speeds, direction, and duration. The controllers also provide adjustable parameters to tune the process for specific features and needs. The vision & process monitoring system in the AIC unit uses a wide range of optical and noncontact instruments to detect and monitor the process variables. The machine is used to provide real-time visual feedback of the wafer surface through the entire fabrication process. This allows for process optimization to ensure repeatability and maximum efficiency. The AIC tool is designed as an all-in-one asset to provide efficient, precise and reliable semiconductor device processing. With its integrated model, the AIC equipment offers a superior quality performance, a low total cost of ownership, and a dramatic shortening of the fabrication process.