Used VEECO / ADVANCED IMAGING Robo 4 #9241333 for sale

VEECO / ADVANCED IMAGING Robo 4 is a state-of-the-art wafer grinding, lapping and polishing equipment designed to meet the most stringent requirements for in-depth imaging applications for wafer distal dicing, processing, and polishing. It's a modular system that can be customized to fit any production process with the help of its easily configurable interface. VEECO Robo 4 is designed to deliver superior control over process parameters such as speed, pressure, material removal and process monitoring. It features a powerful 5-axis motion controller and a high-speed multi-axis motion unit with 5 different rotors, allowing for precise process control. The machine includes an automatic CNC loading and unloading of wafers, as well as wafer alignment and backside cleaning capabilities. It also includes a programmable Z-axis stage for in-process and/or post-polishing wafer handling. ADVANCED IMAGING Robo 4 delivers superior process robustness with its exceptional precision, accuracy and repeatability while protecting the wafer from thermal, mechanical and chemical damage. The mechanical design of Robo 4 ensures the highest level of precision and stability of the process environment. The programmable pressure adjustment and air flow-limit control offer maximum flexibility for media selection and grinding dynamics. VEECO / ADVANCED IMAGING Robo 4 also provides superior process control, enabling users to monitor and adjust all process parameters in real time. The in-process monitoring tool allows for sensorless, real-time control of process parameters such as media removal, grinding pressure, and surface finish. The asset is protected against thermal, mechanical and chemical damage with a temperature controller and environmental filter. VEECO Robo 4 offers unmatched performance and reliability for wafer grinding, lapping and polishing applications. With its advanced automation, superior process control and consistent quality, it is ideal for high-volume production and repeatable processes. The model is the perfect choice for the most demanding in-depth imaging processes including wafer grinding, lapping and polishing.