Used VEECO / ADVANCED IMAGING Rough Lap Aligner #9397454 for sale

VEECO / ADVANCED IMAGING Rough Lap Aligner is an automated wafer grinding, lapping and polishing equipment designed to produce smooth, even surfaces on wafer substrates. This system is capable of handling a range of wafer sizes and types, from 45um to over 6 inches in diameter. The unit uses an automated abrasive lapping process to produce a highly polished, flat surface on the wafer substrate. It utilizes an array of precision-controlled grinding and lapping heads that move along a set of linear rails to provide a uniform, consistent finish on the substrate. This motion is guided by an CNC based control machine, which allows for precise accuracy and control of the grinding and lapping process. The tool has a built-in metrology asset designed to measure the surface of the wafers, providing feedback to the operator to ensure the highest level of accuracy and precision. The metrology model can also be used to analyze surface finishes, enabling the operator to adjust parameters to optimize the grinding and lapping process. In addition, the equipment utilizes an VEECO system, which captures images of the work piece and then compares them to its original state. This allows for a more reliable production process as well as detailed images of each wafer that can be shared with customers. The unit also includes an automated cleaning machine to ensure a consistent high level of cleanliness throughout the production process. This cleaning tool uses filtered air to rapidly remove particles from the wafer surface. Overall, VEECO Rough Lap Aligner is an automated wafer grinding, lapping and polishing asset that provides the highest level of precision, accuracy and control. It utilizes an ADVANCED IMAGING model to provide detailed images of the work piece, allowing for more reliable production and customer satisfaction. Additionally, it features a metrology equipment and automated cleaning system, ensuring a uniform finish and clean surface every time.