Used VOUMARD 5A #9350280 for sale

ID: 9350280
Universal internal grinding machine Grinding diameter: 5-200 mm Grinding depth: 250 mm Center height: 260 mm Swing: 300 mm Work piece length: 500 mm Spindle taper: 70 m Work head speed: 125-1000 RPM Work head swivel: 90° Table feed: 0-10 m / min Spindle speed: 3600 - 40000 RPM Spindle diameter: 90 mm.
VOUMARD 5A is a stationary, fully automatic wafer grinding, lapping & polishing equipment used for the production of devices such as MEMS, SOI, BiCMOS, and ASIC. The system utilizes a pair of quartz wafer carriers which operate in dual-chambers, and a 6-axes robotic manipulator which is capable of producing parts with 1μm surface roughness and 50nm accuracy. At the heart of the unit is a precision, low-abrasive grinding machine, which utilizes a flexible abrasive media to process the wafers. The grinding process is modular, allowing for different types of abrasive processes. This results in a consistent surface finish as well as reduced wear and tear on the wafers. 5A also features an advanced lapping tool, which uses abrasive paste to further refine the surfaces of the wafer. This allows the wafer to achieve high uniformity and surface roughness values. The asset also features a polishing model, which utilizes a specialized polishing application called Quick-pass. This is used to provide a highly glossy finish to the wafer surface. VOUMARD 5A is a highly efficient and precise equipment which is capable of producing high quality devices in a short period of time. It is also designed for low overall cost, as it is designed to reduce time, maintenance, and energy consumption. The combination of all these features makes 5A the ideal choice for production of MEMS, SOI, BiCMOS, and ASIC devices.
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