Used WALTER HELITRONIC VISION #9084484 for sale
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ID: 9084484
Grinder
(5) CNC axes
Max. diameter: 320mm
Max. grind length from workhead ISO 50 taper gage point: 300mm
Linear axes rapid traverse rate: up to 2,000 IPM (50m/min)
Rotary C-axis rapid traverse rate: 120º/sec
Workhead A-axis: 0 - 750rpm
Grinding spindle: 40HP, up to 10,000rpm
Max. grinding wheel diameter: 200mm
Control: Fanuc Series 310i Model A5.
WALTER HELITRONIC VISION is a wafer grinding, lapping, and polishing equipment designed specifically to process small and medium sized wafers. This system is well suited for single-sided and double-sided wafer planarization, edge and back-side grinding, and polishing of a wide variety of materials, including silicon, quartz, ceramic, glass, and metal. HELITRONIC VISION features a number of high-end features that make it an ideal unit for wafer processing. The machine has a large work area to accommodate larger wafers, and features a fully automatic process control to ensure precision accuracy. Additionally, the tool is equipped with an automatic tool loading and unloading asset, as well as integrated machine vision for precision orientation and alignment of wafers. The model's grinding, lapping, and polishing tools are designed to provide a high uniformity of surface quality with a minimal increase in process time. It also offers a number of different diamond and abrasive tools to handle a range of required machining capabilities. For example, the equipment comes with segmental wheels for face grinding; segmental and continuous-rim wheels for band grinding; individual diamond-grinding tools for lapping, and segmented-, continuous-rim-, and individual-diamond-grinding tools for polishing. WALTER HELITRONIC VISION is a state-of-the-art system that ensures the highest precision possible in wafer-level processing. With its versatile tool library and process control capabilities, it is an ideal choice for all kinds of wafer processing needs. It is also compatible with a wide range of sophisticated wafer handling technologies, further increasing its capabilities. With its smart features and adaptable design, HELITRONIC VISION ensures an efficient and precise wafer grinding, lapping, and polishing process.
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