Used WANJUN ENGINEERING LP-330R #293623151 for sale

WANJUN ENGINEERING LP-330R is a state-of-the-art precision wafer grinding, lapping and polishing equipment. This system can process silicon and compound semiconductor substrates as well as hard and brittle materials with its ultra-precise diamond grinding, lapping, and polishing technology. The unit is suitable for applications in semiconductor research and testing, MEMS device fabrication, and wafer fabrication processes. LP-330R consists of two main components. The first component is a grinding station, which contains two diamond grinding wheels and a two-axis stage. This allows for precise grinding of the workpieces, such as silicon and compound semiconductor substrates or hard and brittle materials. The grinding station is powered by a brushless DC motor and is capable of achieving high process accuracy and repeatability. The second component is a polishing station. This station consists of a three-axis precision polishing stage, as well as two diamond lapping wheels. This allows for precise lapping and polishing of the workpieces being processed. The polishing station is powered by a servomotor and is capable of achieving high process accuracy and repeatability. WANJUN ENGINEERING LP-330R is designed for high-precision, low-damage processing of the workpieces. It is built with dual-stage control technology, allowing for precise control of the grinding, lapping, and polishing parameters. This includes controlling the position of the grinding wheels, the pressure between the grinding and lapping wheels, and the spindle speed. The machine is equipped with a high-resolution imaging tool, which can be used to monitor the parameters and conditions of the various processing stages. This ensures that the workpieces are subjected to the optimal process, while still achieving the required accuracy and quality. LP-330R is also equipped with a powerful cooling asset, which ensures that the process temperature is maintained at a consistent level. This helps to eliminate the risks associated with heat damage and material abrasion. Finally, WANJUN ENGINEERING LP-330R is equipped with a user-friendly software interface, allowing for easy input of process parameters and control of the model. This provides the flexibility to adjust the process as needed, as well as the monitoring of process results. In summary, LP-330R is a state-of-the-art precision wafer grinding, lapping and polishing equipment. Its dual-stage control technology and high-resolution imaging system ensure that it can achieve high process accuracy and repeatability. Its powerful cooling unit and user-friendly software interface make it a reliable and versatile machine that is suitable for a wide range of applications.