Used WEC WSP-610N #9219851 for sale

WEC WSP-610N is an advanced grinding, lapping and polishing equipment designed to process wafers with high precision and accuracy while reducing the need for manual fatigue and increasing operator ergonomics. Utilizing a precise mechanical design, WSP-610N features a user-friendly display and intuitive touchscreen controls, allowing for easy operation of the system. WEC WSP-610N is equipped with an integrated unit for grinding, lapping and polishing 6 to 12 inch wafers, with superior surface finish, edge profile and particle size control. It utilizes electrodynamic feeds and scanning to achieve high precision results, while flexibly accommodating various types of advanced wafer materials. A variety of sequence settings can be programmed for efficient and precise processing, with up to eight grinding, lapping and polishing operations including array grinding, off-center wafer lapping and adjustable step rate for the grinding step. In addition, a computerized monitoring machine allows for user-defined thresholds for process parameters, such as grinding speed and wheel parameters for optimal operation. WSP-610N also offers a unique and advanced water-cooled design, which provides an effective temperature control to ensure reliable processing of a wide range of materials. Using advanced vacuum technology, WEC WSP-610N can process wafers with a wide variety of sticking problems, while its modular approach allows for easy maintenance and upgrades. Additionally, the smart design of the cover for the debris chamber allows for quick and easy access to the chamber if cleaning or maintenance is required. Overall, WSP-610N is a reliable, efficient and precise grinding, lapping and polishing tool that is a must-have for advanced wafer processing operations. With its high quality design, intuitive touchscreen controls and advanced features, WEC WSP-610N is the ideal choice for achieving the best results in the most efficient way.