Used WENDT WAC 705 #9081486 for sale

WENDT WAC 705 is a precision wafer grinding, lapping & polishing equipment that provides superior surface finish and accuracy. This high performance system is designed to grind, lap, and polish diametrically opposite sides of a wafer simultaneously. WAC 705 unit is equipped with a powerful motor and a dynamic platen motion technology that allows for higher uniformity and well-defined wafer edges. The machine features a precise, high speed grinding and lapping development method that ensures a smooth surface finish. WENDT WAC 705 has a top-mounted sanding belt with a high surface grinding speed and low material removal rate, making it ideal for high precision work. It also features a dual grinding wheel tool which allows for independent grinding for both sides of the wafer; this helps to achieve a consistent surface finish across the entire wafer. The asset also has a slurry reservoir, which is filled with a slurry of customized abrasive particles that helps to evenly polish the grinding surface. The model also includes a continuously variable drive motor which provides greater speed control and easier operation. Once completed the wafers are automatically transferred out of the grinding and lapping equipment and onto the automated polishing system. The automated polishing unit includes a 12" diameter rotary polisher that has an adjustable speed and pressure control. The polisher provides a highly uniform polishing of planar and non-planar wafers with a uniformity that is unmatched in the industry. WAC 705 is designed to produce optimally flat wafers with a uniform surface finish and minimal particulate contamination. WENDT WAC 705 machine is an ideal choice for companies looking to produce semiconductor and MEMS wafers with a high level of surface accuracy and feature integration.