Used WENDT WAC 715 Centro #9044739 for sale

WENDT WAC 715 Centro is a high-performance wafer grinding, lapping and polishing equipment designed to deliver superior surface finish with maximum throughput. The WAC 715 utilizes a high speed single-axis spindle drive to achieve a maximum grinding speed of up to 150,000rpm. A variable frequency drive allows for precision control of the motor speed during operation. The WAC 715 is equipped with a powerful diamond grinding head and a range of dispense tanks and lapping plates to accommodate different materials and sizes. The diamond grinding head is fitted with special high-precision bearing blocks and integrated temperature control to maintain optimal performance. The grinding head is also designed to balance itself within 0.01-grains, resulting in an ultra-smooth surface finish with minimal thermal distortion. The WAC 715 also features a PLC-based touch screen interface that allows the user to customize the machine's settings according to a particular job's requirements. This includes setting the grinding speed, feed rate, and the depth of the cut. Additionally, the system includes automated safety functions such as e-stop and interlocks which prevent unintentional unit operation. The WAC 715 also has a range of polishing plates and media which allow for a wide range of finishes. The plates can be adjusted to a range of angles and positions for maximum efficiency. Additionally, the machine features a powerful dust extraction tool which provides maximum visibility and safety during operation. Overall, WAC 715 Centro is a powerful and versatile wafer grinding, lapping and polishing asset which is able to deliver superior surface finish with maximum throughput. With a range of adjustable settings and automated safety features, the WAC 715 ensures maximum reliability and accuracy in any grinding and polishing application.