Used WENDT WAC 715 #9222161 for sale

WENDT WAC 715
ID: 9222161
Grinders Scalar.
WENDT WAC 715 wafer grinding, lapping & polishing equipment is an advanced solution designed for the most demanding applications in semiconductor, optoelectronics, power device and LED industries. This ultra-precision system offers a flexible, cost-efficient solution for grinding, lapping, polishing and dressing of wafers up to 6-inch. It is designed to be a one-stop solution that can handle all of the necessary precision grinding, lapping, and polishing processes. WAC 715 features a state-of-the-art diamond table and its unique three-stage grinding, lapping and polishing set-up for the ultimate in wafer finishing. The unit uses an abrasive wheel to grind the wafer's surface to the desired geometry. The abrasive wheel is guided by a precision linear encoder, which allows for precise, repeatable results every time. After grinding, the wafer is lapped and polished using a slurry of diamond particles in a rotating set-up. This allows for a perfectly flat, low roughness surface. The final stage in the process is the dressing of the wafer to a preferred finish. This automated machine also comes equipped with a comprehensive tool diagnostics capability, allowing operators to monitor the asset's performance and quickly identify and solve problems. It is also energy-efficient with low vibrational noise and low temperature production, allowing for longer production runs without downtime. The model is also easy to use, requiring minimal operator training for its operation and maintenance. WENDT WAC 715 is a fully-automated equipment, designed for repeatable accuracy and precision with minimal operator input. This advanced system is capable of producing the best possible finish on the wafers it processes, allowing for the highest level of accuracy, repeatability and uniformity. Its integrated unit diagnostics and energy-efficient features make it an ideal choice for production purposes. It is an ideal choice for anyone looking for an efficient, cost-effective wafer grinding, lapping and polishing machine.
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