Used WENDT WAC 715 #9273623 for sale

WENDT WAC 715 is a professional wafer grinding, lapping, and polishing system designed to offer high performance and superior results for silicon wafers. The machine is equipped with a precision spindle and powerful motor to allow for a wide range of grinding, lapping, and polishing operations. WAC 715 utilizes the principle of trochoidal grinding, lapping, and polishing to achieve high-precision results on silicon wafers. It is designed for high-speed operation on up to 300mm diameter wafers, with a 54" diameter turntable and a maximum rotation speed of 125 rpm. The spindle motor draws an impressive 15.08 horsepower, and has a 2800-degree/sec max rotation rate. It is fitted with a pneumatic workpiece holder system for quick and secure saw wafer loading, and uses water cooling to maintain temperatures. WENDT WAC 715 comes with a variety of grinding and milling tools for a large range of applications. It supports diamond-layer, carbide, and diamond-coated wheels for grinding and milling, and includes attachments and tools for lapping and polishing operations. The adjustable gripping force of the grinding spindle allows for grinding of different wafer thicknesses and shapes. The unit is equipped with a protective hood to keep airborne particles and machine residue at bay. WAC 715 also boasts a human-machine interface with integrated high-speed data acquisition to make user-programming easier. The machine is designed with a rigid machine frame to reduce vibration and increase precision, and its electrical cabinet is well-sealed for protection from dust and debris. The unit is equipped with several safety mechanisms to avoid accidents from operators. Finally, WENDT WAC 715 is easy to move and can be adapted for multiple configurations.