Used WENDT WAC 715 #9385699 for sale

WENDT WAC 715 is a state-of-the-art precision machining machine designed for grinding, lapping, and polishing a wide range of wafer materials and sizes. This equipment is equipped with a large CNC grinding spindle, several various milling and lapping heads, and a fully automated loading and unloading system. The CNC grinding spindle utilizes precision grade components, ensuring high accuracy and repeatability. The spindle speed is adjustable, allowing the user to customize the grinding process for the specific wafer material and size. The grinding head is specifically designed with low thermal expansion and thermal conductivity properties, making it highly effective at fine grinding without causing warping or damage. The lapping heads on WAC 715 work to provide smooth, uniform surfaces on the wafers. To maximize efficiency, a variety of lapping tools are available and can be exchanged quickly and easily. The lapping heads provide high precision and accuracy, as well as fast and repeatable cycles. The unit is also equipped with an automated loading and unloading machine. This tool uses robotic arms to quickly and accurately place the wafers on the spindles and can even inspect the finished wafers for any defects. In addition, WENDT WAC 715 can be upgraded easily to increase its grinding power and production speed. Overall, WAC 715 is an ideal solution for wafer grinding and lapping applications. The machine is durable and reliable, making it ideal for high precision production purposes. Its automated loading and unloading asset, as well as a variety of grinding and lapping heads, make it easy to customize the process to suit various materials and sizes.