Used WENDT WAC 715 #9385705 for sale

WENDT WAC 715 is a state-of-the-art wafer grinding, lapping and polishing equipment designed for precision surface finish applications. Built to stringent German engineering standards, WAC 715 is extremely reliable and designed for use in a wide range of research and production environments. The system features a closed-loop spindle design and operates at speeds up to 4,000 rpm. The spindle housing is designed for easy installation and removal and is made of aluminum for superior corrosion resistance and strength. The spindle housing has five adjustable axes of control, allowing for precise machining of wafers. WENDT WAC 715 includes two-stage grinding/polishing heads and a three-stage lapping head. The grinding/polishing heads can be used to precisely shape the wafers with minimal machine chatter or vibrations. The lapping head features eight separate, adjustable axes and can be used to achieve a variety of surface finishes. The unit also features a state-of-the-art pressure control and monitoring machine and a high efficiency liquid/gas separator. The pressure control tool utilizes an array of sensors and valve actuators that allow the flow of grinding liquid to be precisely controlled during operation. This helps to ensure that the wafer surfaces are precision machined without over-saturating the surface. The liquid/gas separator removes any unwanted gas/liquid from the asset during operation, providing the user with a clean result. WAC 715 also includes an abrasive management model. This allows the user to precisely control the amount of abrasive material used during operation and to adjust the machine's grinding force accordingly. The equipment also includes a fast-acting shutoff valve that can be programed to react in the event of a pressure spike or overload situation. Finally, WENDT WAC 715 is equip with a comprehensive set of diagnostics that allow the user to identify and troubleshoot any issues with the system in real time. The diagnostics provide detailed reports regarding unit performance parameters such as pressure, speed, temperature, and vibration. In summary, WAC 715 is an extremely reliable and efficient wafer grinding, lapping and polishing machine. Its robust design, precise control, and robust diagnostics make it an excellent choice for any research or production environment.