Used WENDT WAC 725 #9044736 for sale

WENDT WAC 725 is a cutting-edge wafer grinding, lapping and polishing equipment designed to meet the exacting requirements of the most demanding semiconductor applications. WAC 725 offers the flexibility to accommodate a variety of wafer sizes and shapes, complex geometries and features. WENDT WAC 725 system integrates advanced and proven technologies into an easy-to-operate, user-friendly unit. Its durable and efficient design provides the ideal environment for any application in semiconductor fabrication. WAC 725 utilizes a powerful main grinding spindle, combined with two vertical grinding spindles, with 6 pre-defined movement axes for precise grinding and polishing action. This makes it possible to grind accurately even the most complex geometries. The machine comes with high-tech controls that allow for quick and easy programming. The built-in automation also provides users with complete control over the process of creating the highest quality wafer surfaces. WENDT WAC 725 also incorporates an efficient lapping process, ensuring that the highest quality wafers are produced. Its superior lapping plates employ a unique high-vacuum and low-pressure lapping method that ensures optimum wafer surface quality. The high-precision polishing procedure of WAC 725 uses a high-precision adaptive polishing tool that allows for fast and accurate polishing results. This asset ensures a homogeneous surface finish and surface morphology with consistent results. Overall, WENDT WAC 725 is an advanced wafer grinding, lapping and polishing model that provides high-precision and precise results. This equipment is designed to meet the rigorous requirements of the most demanding semiconductor applications. The system is easy-to-operate, reliable and efficient, making it the ideal choice for any application in semiconductor fabrication.