Used WENDT WCD 44 RA #9066973 for sale

WENDT WCD 44 RA is a high-performance, fully automated wafer grinding, lapping and polishing equipment designed for semiconductor wafer edge prepping requirements. It is appropriately used for automated application of precise, leak tight chamfers to the edge of individual wafers. This is an extremely important step in the manufacturing of a wide range of electronic devices. WCD 44 RA uses a main tool head tool to grind, lap and polish wafer edges. This tool is capable of providing reliable and accurate machining of wafer edges with high productivity. It is equipped with its own self-regulating cooling system to ensure the optimal temperature conditions for the wafer process. Additionally, it is capable of providing an adjustable machining speed and a defined final shape to the wafer. The unit is composed of several components which are mounted on the working area to complete the grinding, lapping and polishing tasks. First, the main tool head is supported by three wheel-less angular bearing guides, which are arranged in the working area. The wheels make sure the toolhead and abrasive head are aligned perfectly in order the tool axis remains precisely in the same place. The abrasive head of WENDT WCD 44 RA is supported by a multiple segment stop ring and multiple grade plates of a spindle. The multi-grade plate machine ensures desired surface specifications and grinding, lapping and polishing speeds. The abrasive head is also designed with a double rack and pinion tool, enabling the abrasive head to adapt to irregular workpiece shapes. The cutting edges of WCD 44 RA are coated with multi-layered, diamond-based coatings, which provide superior wear-resistance and improved lubricity. The diamond coatings are thermally and chemically engineered to reduce grinding temperatures and provide higher abrasion-resistant properties. It is further engineered to stay accurate and re-sharpenable, so it can be used for a longer time period. WENDT WCD 44 RA also includes several safety features and an emergency stop switch to ensure the safety of the operator. Dust extraction is managed by an external dust collector, which filters out airborne dust particles and other contaminants created during the grinding process. WCD 44 RA is a robust and reliable wafer grinding, lapping and polishing asset that is capable of producing superior wafer results at higher speeds and better cycle times. It is ideal for improving the performance of high-end processor products in the semiconductor industry.