Used WESTWIND D1686-12 #153670 for sale
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ID: 153670
Air bearing spindles
HF180
Maximum speed: 180,000 rpm
Average running hours: 750.
WESTWIND D1686-12 is a fully automated wafer grinding, lapping, and polishing equipment. This system is designed to quickly and cost-effectively achieve the highest level of wafer surface finish with precision, accuracy, and repeatability. It is an ideal choice for creating thin layers of semiconductor materials, quartz, ceramic, and other substrates. The unit is composed of two main parts: a wafer grinding unit and a wafer polishing unit. The grinding unit is composed of four grinding heads that conform to the shape of the substrate material. The heads are designed to apply the necessary grinding power, pressure, and controlled force to yield the required surface finish. The polishing unit comprises of two independently-programmed polishing heads and will offer the end user with the ability to execute multiple polishing operations in a single run with a single wafer. The operation of D1686-12 wafer grinding, lapping, and polishing machine is controlled by a user-friendly graphical user interface (GUI). This allows for data input, parameter settings and live product tracking. Additionally, it is equipped with an integrated tool for reducing the potential for product contamination by systems using removable cartridges. The removable cartridges also provide cost savings through safe and easy way of exchanging consumables such as polishing pads and grinding disks without having to touch the product. The asset is also compatible with peripheral systems including CCD cameras, automation, and data acquisition for quality control. This allows for efficient operation and traceability. Furthermore, WESTWIND D1686-12 takes advantage of a modular construction that permits custom configurations according to the user's particular requirements. This makes it a great choice for both small and large scale production operations. D1686-12 wafer grinding, lapping, and polishing model is easy to use and maintain, giving users the ability to produce high-precision wafers that meet the highest standards of surface finish. It provides a customizable design and is an excellent choice for manufacturers and laboratories that need to consistently produce high-quality parts faster and more cost-effectively.
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