Used WILSON / ACCO / TUKON MO #108700 for sale

WILSON / ACCO / TUKON MO is a wafer grinding, lapping, and polishing equipment that is most commonly used in the semiconductor and optoelectronic industries. This system typically uses five different tools to achieve the desired results. The cutting tool is used to section the target efficiently while reducing the pressure on the sample. The grinding tool is used to create a planar surface in which excess material can be removed in preparation for lapping. The lapping tool uses a lower force than grinding to achieve the desired finish, creating a flat and even surface. After lapping, the polishing tool extrudes a thin film to further refine the sample surface. The last tool is the diamond edger, which is used for impurity removal and initial cleanup. This unit is also capable of using a variety of abrasive media to further fine-tune the results. ACCO MO machine provides the necessary precision, accuracy, and repeatability that is needed for the most difficult tasks. It is equipped with an advanced air bearing spindle affording greater speed and smoother operation. The spindle is designed to withstand high levels of torque and force. Also, for enhanced vibration reduction, it can be directly mounted on the wafer to reduce movement. This tool also features a wide range of features that serve to further improve its overall efficiency and performance. This includes a digital load cell accuracy control and vacuum chuck to hold the wafer in place. It also provides a high-flow flat stage, an automated sample-to-mechanical control asset, empirical mode control, embedded motion control, and an intuitive user interface. TUKON MO is one of the most advanced wafer grinding, lapping, and polishing systems on the market. Its user-friendly operation, powerful features, and quality results make it one of the most sought-after systems for wafer grinding, lapping, and polishing. With its range of tools, accuracy control, and advanced features, this model can perform tasks not possible with any other equipment.