Used WILSON / ACCO / TUKON MO #146879 for sale

WILSON / ACCO / TUKON MO is a wafer grinding, lapping, and polishing equipment designed to increasethe accuracy and throughput of wafer-based device production. This modular system is built to precise quality standards and is capable of completing a variety of precise micro-fabrication tasks such as lapping and polishing of flat, curved, or angled wafers. Additionally, the unit is customizable and automatic, allowing the user to adjust the machine parameters to best suit their needs. ACCO MO tool comprises of three key components: a wafer grinding stage, a lapping stage, and a polishing stage. The grinding stage uses a motor-driven rotary table with a diamond-grinding wheel, and can process wafers of up to 150mm in diameter; this stage is used to grind off sharp edges that can cause burrs and other defects during processing. The lapping stage involves placing the wafers on an abrasive-coated rotary table and applying pressure via mechanical arm to lap the wafer surfaces. The final step, polishing, uses the same rotary table and applies a lubricant to the surface along with mechanical pressure, to achieve a perfectly flat and smooth result. TUKON MO asset is also designed to be easy to use and maintain. It can be programmed to automatically run process steps and also set up pre-programmed settings for tasks such as grinding, lapping, and polishing. Additionally, the model is capable of obtaining data such as surface roughness, roundness, flatness, and shape, which allows users to make sure the wafer meets the desired specifications. WILSON MO offers superior degree of accuracy and performance, making it ideal for precision work in a variety of industries, including electronics, automotive, medical device, aerospace, and semiconductor fabrication. The equipment is able to process wafers of various material types with quick speed and efficiency, as well as its easy-to-use design makes it easy for operators to setup and run a variety of processes. MO is the perfect wafer grinding, lapping, and polishing system for large-scale wafer fabrication.