Used WILSON / ROCKWELL 3JR #9293108 for sale

WILSON / ROCKWELL 3JR is a wafer grinding, lapping & polishing equipment designed to meet the rigorous demands of modern-day semiconductor and optoelectronics manufacturing. This system utilizes advanced technologies to provide precision surfaces, accurate flatness, and ultra-low scratch density. It is designed to be highly controllable and reliable, ensuring that it consistently delivers excellent results in sensitive applications. This unit features a range of state-of-the-art components, including: a precision grinding drive and control machine, a single-sanding belt grinding head, a lapping wheel, and two polishing pads. The grinding head utilizes a high-precision stepper motor and encoder to deliver a high degree of repeatability. The single-sanding belt is driven directly by the grinding head, ensuring a controllable material removal rate throughout the operation. The lapping wheel is highly accurate, providing excellent flatness and low stress on the wafer. Two different polishing pads are available, optimized for either high-voltage ion milling-based polishing, or chemical-mechanical polishing (CMP). WILSON 3JR wafer grinding, lapping & polishing tool has a compact footprint, low noise output, and can be utilized in both vertical and horizontal operations. Its intuitive industrial control asset allows for easy integration with existing production equipment, and its user-friendly software offers quick parameter adjustment capabilities. The model also features an integrated interference fit between the grinding head and the lapping wheel, providing a secure and reliable connection even during harsh industrial conditions. Overall, ROCKWELL 3JR offers excellent flexibility and precision, making it an ideal choice for a variety of sensitive semiconductor and optoelectronics manufacturing applications. It is designed to offer superior reliability, increased efficiency, and precise surface finishes. By combining this equipment with the right chemical-mechanical polishing solutions, manufacturers can take advantage of a wafer grinding, lapping & polishing system that is capable of delivering excellent results in a wide range of applications.