Used WILSON / ROCKWELL 410-C #9293079 for sale

WILSON / ROCKWELL 410-C Wafer Grinding, Lapping, and Polishing Equipment is a versatile machine that has revolutionized the semiconductor industry. It is a one-stop solution for grinding, lapping, and polishing wafers at virtually any size. The system can process wafers of up to 400mm in diameter with a guaranteed repeatability of ±5 microns. WILSON 410-C is an automatic unit, which allows the user to set up their parameters and let the machine do its job with minimal user attention. The motion control provides accuracy and flexibility, with a 0.1 micron resolution of the motive force. The surface finish of the wafer is achieved through the machine's proprietary polishing program. ROCKWELL 410-C utilizes media mapping technology which precisely positions grinding, lapping, and polishing media on the wafer. This ensures the highest possible quality of the finished product. The tool also features a variety of ex-post process options, such as edge trimming, notch corner radius adjusting, and beveling. This is especially useful for wafers that have been split after the grinding process. The asset is easy to use, with a graphical touchscreen interface providing intuitive control. 410-C utilizes the Windows operating model, allowing for fast, easy, and accurate data transfer. All parameters and data can be stored for easy access and analysis. WILSON / ROCKWELL 410-C Wafer Grinding, Lapping, and Polishing Equipment has been specially designed to help manufacturers obtain the highest surface quality of any wafer quickly and efficiently. Its high accuracy, automated features, and versatile design make it the ideal choice for the most demanding production environments.