Used WILSON / ROCKWELL 6838 #9293081 for sale

WILSON / ROCKWELL 6838 is a high-performance, multi-tasking wafer grinding, lapping, and polishing equipment designed to enable efficient single- and multi-level wafer processing. This versatile equipment is ideal for complex interconnects and other thin wafer applications. WILSON 6838 system consists of two main components: a grinding/polishing chuck and a rotary index table. The chuck is a self-contained pneumatic loaded device, which is mounted to a gimbal carrying a DUST-TIGHT® wafer suspension ring. This chuck uses a unique air loading unit to maintain a constant tension on the wafer, ensuring complete processing on the full surface area of the wafer. The chuck has a variable frequency drive (VFD) that allows for rpm control up to 3000. It also features auto-collar functions and an integrated vacuum machine for wafer transport. The rotary index table holds up to 8 independent wafer holders arranged in a circle, and rotates the wafer incrementally for each operation, which allow multiple operations on each side of the wafer. It employs a stepper-motor tool driven by a precision timing asset for precise indexing, so that all processing steps can occur accurately. The model also includes a state-of-the-art wafer suspension equipment, consisting of a multi-stage, variable speed transfer robot with adjustable height and pivot capability and a single-arm articulated robotic arm, which can be either manually controlled or interfaced with a computer-controlled system. This allows for high precision loading and handling of wafers during the polishing process. The components of ROCKWELL 6838 unit effortlessly integrate cutting-edge engineering technology, allowing for precise and repeatable wafer grinding, lapping, and polishing operations. It provides optimal solutions for R&D and small-scale manufacturing processes, making it a preferred choice for personnel in semiconductor and other industries. Its efficient wafer handling solutions reduce the time and cost associated with manual operations. In terms of accuracy, this machine offers minimal surface roughness and impressive substrate uniformity.